※ Adopting a solid-state relay dynamic parameter testing system

※ The flexible thermal conductive pad effectively reduces contact thermal resistance and overcomes stress

※ The "thermal fatigue loading" cyclic testing method adopted
※ Reliable design of large capacity silicon wafers for large horse drawn carts
※ DCB technology (copper ceramic bonding base plate)
※ Input stage for photoelectric isolation, TTL level compatible input, DC or pulse triggering method.
※ Safety insulation voltage between inputs, outputs, and bottom shells above 2000V, UL approved safety components.
※ No contact points, no mechanical moving parts, no sparks, no action noise, vibration resistance, long service life.
※ Small dead zone voltage, small harmonic interference (Z-type), built-in RC absorption circuit.
※High power, AC working current of 3-500A, working voltage of 220-380V across the entire series.
※Industrial grade products use thyristor chips and imported German low thermal resistance copper ceramic bonding (DCB) substrates.